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335824B00000G |
Heatsink: extruded |
BOYD CORP |
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341900F00000G |
Heatsink: die-cut; PCl/AGP Chip Sets; L: 19.1mm; W: 76.2mm; H: 330um |
BOYD CORP |
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342940 |
Heatsink: attachable; grilled; BGA; L: 37.58mm; W: 38.5mm; H: 14mm |
BOYD CORP |
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342949 |
Heatsink: attachable; grilled; BGA; L: 80mm; W: 80mm; H: 12mm; copper |
BOYD CORP |
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374124B60023G |
Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm |
BOYD CORP |
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374324B00032G |
Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm |
BOYD CORP |
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374724B60024G |
Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm |
BOYD CORP |
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374924B00035G |
Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm |
BOYD CORP |
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375324B00035G |
Heatsink: extruded; grilled; BGA,FPGA; black; L: 10.2mm; W: 10.2mm |
BOYD CORP |
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375424B00034G |
Heatsink: extruded; grilled; BGA,FPGA; black; L: 15.3mm; W: 15.2mm |
BOYD CORP |
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501503B00000G |
Heatsink: die-cut; TO3; black; L: 47.75mm; W: 35.56mm; H: 25.4mm |
BOYD CORP |
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504102B00000G |
Heatsink: die-cut; U; TO220; black; L: 21.59mm; W: 19.8mm; H: 17.8mm |
BOYD CORP |
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518-95AB-MET725 |
Heatsink: extruded; grilled; TO218,TO220; black; L: 61mm; W: 57.9mm |
Wakefield Thermal |
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518-95AB-T725 |
Heatsink: extruded; grilled; TO218,TO220; black; L: 61mm; W: 57.9mm |
Wakefield Thermal |
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529901B02500G |
Heatsink: extruded; H; TO218; black; L: 25.4mm; W: 41.91mm; H: 50.8mm |
BOYD CORP |
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Buy Now |
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530002B02500G |
Heatsink: extruded; H; TO220; black; L: 25.4mm; W: 41.91mm; H: 63.5mm |
BOYD CORP |
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Buy Now |
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530714B00000G |
Heatsink: die-cut; U; TO220; black; L: 12.7mm; W: 25.4mm; H: 18.03mm |
BOYD CORP |
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Buy Now |
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530801B05150G |
Heatsink: die-cut; TO220; black; L: 12.45mm; W: 45.7mm; H: 44.45mm |
BOYD CORP |
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Buy Now |
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531002B02500G |
Heatsink: extruded; H; TO220; black; L: 12.7mm; W: 34.92mm; H: 25.4mm |
BOYD CORP |
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Buy Now |
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532702B02500G |
Heatsink: extruded; H; TO220; black; L: 25.4mm; W: 41.91mm; H: 50.8mm |
BOYD CORP |
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Buy Now |
