Heatsinks - equipment

Showing 161 to 180 of 223 entries
Image Manufacturer Part Number Descrp Manufacturer
SI481 Heat transfer pad: silicone; TO3; Thk: 0.23mm; 900mW/mK; -60÷200°C ALUTRONIC Buy Now
SI485 Heat transfer pad: silicone; SOT32; Thk: 0.18mm; 900mW/mK; 4kV ALUTRONIC Buy Now
MO455 Heat transfer pad: polycarbonate with fiberglass ALUTRONIC Buy Now
CLIP-MC28 Retaining spring ALUTRONIC Buy Now
TO220-SET-02-S Insulation kit for transistors; TO220 STONECOLD Buy Now
SI480 Heat transfer pad: silicone; TO3; Thk: 0.18mm; 900mW/mK; -60÷200°C ALUTRONIC Buy Now
KC-196/SOT-32 Retaining spring; L: 17.5mm; H: 11.2mm; natural SEIFERT ELECTRONIC Buy Now
EYGS0404ZLMP Heat transfer pad: graphite; L: 38mm; W: 36mm; Thk: 0.2mm; 20W/mK PANASONIC Buy Now
KC-225 Retaining spring; L: 16.4mm; H: 4mm; natural SEIFERT ELECTRONIC Buy Now
WS/TOP/3/1 Heat transfer pad: silicone; TOP3/1; 0.4K/W; L: 20.5mm; W: 17.5mm FISCHER ELEKTRONIK Buy Now
IS585 Heat transfer pad: polycarbonate with fiberglass; Thk: 1.2mm ALUTRONIC Buy Now
KC-195 Retaining spring; L: 44mm; H: 16.3mm; natural SEIFERT ELECTRONIC Buy Now
CD-02-05-190 Heat transfer pad: ulTIMiFlux; L: 254mm; W: 195.85mm; orange Wakefield Thermal Buy Now
SI499 Heat transfer pad: silicone; for quartz; Thk: 0.23mm; 900mW/mK ALUTRONIC Buy Now
GEL/28/30 Heat transfer pad: gel; L: 300mm; W: 200mm; Thk: 3mm; 2.5W/mK FISCHER ELEKTRONIK Buy Now
HS200TP2-HEI-0 HS200-TP2 HEICO COMPANY LLC Buy Now
GEL/45/50 Heat transfer pad: gel; L: 300mm; W: 200mm; Thk: 5mm; 4.5W/mK; glued FISCHER ELEKTRONIK Buy Now
PL-2-5-254-H Heat transfer pad: silicone; L: 25.4mm; W: 25.4mm; golden; Thk: 2mm Wakefield Thermal Buy Now
MAX07NG Retaining spring; TO220; Max Clip™ Heat Sinks BOYD CORP Buy Now
MAX01NG Retaining spring; TO220; Max Clip™ Heat Sinks BOYD CORP Buy Now