| Image | Manufacturer Part Number | Descrp | Manufacturer | ||
|---|---|---|---|---|---|
|
IS575 | Heat transfer pad: polycarbonate with fiberglass | ALUTRONIC | Buy Now | |
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CLIP-MC28 | Retaining spring | ALUTRONIC | Buy Now | |
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IL555/25 | Heat transfer pad: silicone; TO220; Thk: 0.3mm; UL94V-0; -60÷180°C | ALUTRONIC | Buy Now | |
|
MO445 | Heat transfer pad: polycarbonate with fiberglass | ALUTRONIC | Buy Now | |
|
IL557/30 | Heat transfer pad: silicone; TO218,TOP3; Thk: 0.3mm; UL94V-0; 10kV | ALUTRONIC | Buy Now | |
|
SI481 | Heat transfer pad: silicone; TO3; Thk: 0.23mm; 900mW/mK; -60÷200°C | ALUTRONIC | Buy Now | |
|
WSI/TOP/3/235 | Insulator cover; TOP3; 0.96K/W; L: 23.5mm; W: 18mm; H: 5mm; 1.22W/mK | FISCHER ELEKTRONIK | Buy Now | |
|
KHPCO058 | Moulded | FISCHER ELEKTRONIK | Buy Now | |
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MO455 | Heat transfer pad: polycarbonate with fiberglass | ALUTRONIC | Buy Now | |
|
HS200TP2-HEI-0 | HS200-TP2 | HEICO COMPANY LLC | Buy Now | |
|
GEL/45/50 | Heat transfer pad: gel; L: 300mm; W: 200mm; Thk: 5mm; 4.5W/mK; glued | FISCHER ELEKTRONIK | Buy Now | |
|
SI485 | Heat transfer pad: silicone; SOT32; Thk: 0.18mm; 900mW/mK; 4kV | ALUTRONIC | Buy Now | |
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GEL/28/30 | Heat transfer pad: gel; L: 300mm; W: 200mm; Thk: 3mm; 2.5W/mK | FISCHER ELEKTRONIK | Buy Now | |
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IS585 | Heat transfer pad: polycarbonate with fiberglass; Thk: 1.2mm | ALUTRONIC | Buy Now | |
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GEL/45/10 | Heat transfer pad: gel; L: 300mm; W: 200mm; Thk: 1mm; 4.5W/mK; glued | FISCHER ELEKTRONIK | Buy Now | |
|
SI480 | Heat transfer pad: silicone; TO3; Thk: 0.18mm; 900mW/mK; -60÷200°C | ALUTRONIC | Buy Now | |
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EYGS0404ZLMP | Heat transfer pad: graphite; L: 38mm; W: 36mm; Thk: 0.2mm; 20W/mK | PANASONIC | Buy Now | |
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MAX04HNG | Retaining spring | BOYD CORP | Buy Now | |
|
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MAX08NG | Retaining spring; TO218,TO247; Max Clip™ Heat Sinks | BOYD CORP | Buy Now | |
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MAX03NG | Retaining spring; TO220,TO247; Max Clip™ Heat Sinks | BOYD CORP | Buy Now |
