| Image | Manufacturer Part Number | Descrp | Manufacturer | ||
|---|---|---|---|---|---|
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0S507-50-B | Heatsink: extruded | BOYD CORP | Buy Now | |
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0S508-150-B | Heatsink: extruded | BOYD CORP | Buy Now | |
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0S516-15-B-ML516 | Heatsink: extruded | BOYD CORP | Buy Now | |
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0S516-25-B | Heatsink: extruded | BOYD CORP | Buy Now | |
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|
0S516-30-B-ML516 | Heatsink: extruded | BOYD CORP | Buy Now | |
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0S517-50-B | Heatsink: extruded | BOYD CORP | Buy Now | |
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|
0S565-150-B | Heatsink: extruded | BOYD CORP | Buy Now | |
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0S568-150-B | Heatsink: extruded | BOYD CORP | Buy Now | |
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|
0SA36-50-B | Heatsink: extruded | BOYD CORP | Buy Now | |
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1.25GY50 | Heatsink: extruded; TO220 | BOYD CORP | Buy Now | |
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10-5597-22G | Heatsink: extruded; BGA | BOYD CORP | Buy Now | |
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10-5607-05G | Heatsink: extruded; BGA | BOYD CORP | Buy Now | |
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10-6326-27G | Heatsink: extruded; BGA | BOYD CORP | Buy Now | |
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10-6326-28G | Heatsink: extruded; BGA | BOYD CORP | Buy Now | |
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10-6327-02G | Heatsink: extruded | BOYD CORP | Buy Now | |
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10-BRD1-03G | Heatsink: extruded; BGA | BOYD CORP | Buy Now | |
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|
10-L4LB-11G | Heatsink: extruded; grilled; BGA,FPGA; black; L: 45.2mm; W: 41.4mm | BOYD CORP | Buy Now | |
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1130BG | Heatsink: extruded; TO5; L: 9.52mm; W: 9.52mm; H: 11.43mm; aluminium | BOYD CORP | Buy Now | |
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115420012-TEC | Heatsink: extruded; BGA; aluminium; L: 35mm; H: 12.7mm; aluminium | TE Connectivity | Buy Now | |
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122255 | Heatsink: extruded; grilled; aluminium; L: 304.8mm; W: 176.8mm; raw | Wakefield Thermal | Buy Now |
