| Image | Manufacturer Part Number | Descrp | Manufacturer | ||
|---|---|---|---|---|---|
|
325705R00000G | Heatsink: extruded; TO5 | BOYD CORP | Buy Now | |
|
335224B00034G | Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm | BOYD CORP | Buy Now | |
|
342940 | Heatsink: attachable; grilled; BGA; L: 37.58mm; W: 38.5mm; H: 14mm | BOYD CORP | Buy Now | |
|
364424B00032G | Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40.13mm | BOYD CORP | Buy Now | |
|
371924B00032G | Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 13.97mm | BOYD CORP | Buy Now | |
|
372024B00032G | Heatsink: extruded; BGA,FPGA; L: 35mm; W: 35mm; H: 27.9mm; aluminium | BOYD CORP | Buy Now | |
|
372024B00035G | Heatsink: extruded | BOYD CORP | Buy Now | |
|
372924M02000G | Heatsink: extruded; grilled; BGA,FPGA; green; L: 37.4mm; W: 37.4mm | BOYD CORP | Buy Now | |
|
373024B00034G | Heatsink: extruded; BGA | BOYD CORP | Buy Now | |
|
373324M00000G | Heatsink: extruded; grilled; BGA; green; L: 37.4mm; W: 37.4mm; H: 6mm | BOYD CORP | Buy Now | |
|
374024B00032G | Heatsink: extruded; BGA | BOYD CORP | Buy Now | |
|
374024B60023G | Heatsink: extruded; BGA | BOYD CORP | Buy Now | |
|
374124B60023G | Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm | BOYD CORP | Buy Now | |
|
374224B00035G | Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium | BOYD CORP | Buy Now | |
|
374324B00035G | Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm | BOYD CORP | Buy Now | |
|
374424B60023G | Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm | BOYD CORP | Buy Now | |
|
374524B00000G | Heatsink: extruded | BOYD CORP | Buy Now | |
|
374524B00035G | Heatsink: extruded; BGA | BOYD CORP | Buy Now | |
|
374624B00000G | Heatsink: extruded; BGA | BOYD CORP | Buy Now | |
|
374624B00032G | Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm | BOYD CORP | Buy Now |